【英文标准名称】:Informationtechnology-Securitytechniques-Digitalsignatureschemesgivingmessagerecovery-Discretelogarithmbasedmechanisms
【原文标准名称】:信息技术.安全技术.带电文恢复的数字签名方案.基于离散对数的机制
【标准号】:BSISO/IEC9796-3-2006
【标准状态】:现行
【国别】:英国
【发布日期】:2006-10-31
【实施或试行日期】:2006-10-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:数据处理;数据保护;数据安全;数据传输;定义;数字的;数字签名;离散;识别;信息交流;信息交换;信息技术;对数;文电处理;回收;安全;签字;通信;文本处理
【英文主题词】:Dataprocessing;Dataprotection;Datasecurity;Datatransmission;Definition;Definitions;Digital;Digitalsignature;Digitalsignatures;Discrete;Identification;Informationexchange;Informationinterchange;Informationtechnology;Logarithms;Messagehandling;Recuperation;Safety;Signatures;Telecommunication;Textprocessings
【摘要】:ThispartofISO/IEC9796specifiessixdigitalsignatureschemesgivingmessagerecovery.Thesecurityoftheseschemesisbasedonthedifficultyofthediscretelogarithmproblem,whichisdefinedonafinitefieldoranellipticcurveoverafinitefield.ThispartofISO/IEC9796alsodefinesanoptionalcontrolfieldinthehash-token,whichcanprovideaddedsecuritytothesignature.ThispartofISO/IEC9796specifiesrandomizedmechanisms.ThemechanismsspecifiedinthispartofISO/IEC9796giveeithertotalorpartialmessagerecovery.NOTEFordiscretelogarithmbaseddigitalsignatureschemeswithappendix,seeISO/IEC14888-3.
【中国标准分类号】:M11
【国际标准分类号】:35_040
【页数】:80P.;A4
【正文语种】:英语


【英文标准名称】:Semiconductordieproducts-Part8:EXPRESSmodelschemafordataexchange
【原文标准名称】:半导体压模产品.第8部分:数据交换用描述(EXPRESS)模型图解
【标准号】:IEC/TR62258-8-2008
【标准状态】:现行
【国别】:国际
【发布日期】:2008-05
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:组装件;芯片;元部件;数据;数据交换;数据格式;数据表示;定义;电气工程;电学测量;电子工程;电子设备及元件;交换;描述;(数据)格式;执行;集成电路;标记语言;产品数据;生产;半导体晶片;半导体器件;半导体;规范(验收);晶片
【英文主题词】:Assemblies;Chips;Components;Data;Dataexchange;Dataformats;Datarepresentation;Definition;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Exchange;EXPRESS;Formats;Implementation;Integratedcircuits;Markuplanguage;Productdata;Production;Semiconductorchips;Semiconductordevices;Semiconductors;Specification(approval);Wafers
【摘要】:ThispartofIEC62258,whichisatechnicalreport,hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including~wafers,~singulatedbaredie,~dieandwaferswithattachedconnectionstructures,~minimallyorpartiallyencapsulateddieandwafers.ThisTechnicalReportcontainsanEXPRESSmodelschemathatdescribestheelementsneededfordataexchangeandthatwillallowtheimplementationoftherequirementsoftheIEC62258-1,IEC62258-5andIEC62258-6standards,aswellasprovidinganexchangestructurethatiscomplementarytothosedefinedinIEC62258-2.ItisalsocomplementarytoandcompatiblewiththequestionnaireinIEC62258-4.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:28P.;A4
【正文语种】:英语